Better Thermal Management and Smaller Footprint in a Thermal Substrate

June 2, 2009 - PRLog -- Why DPC Metallized Substrate?

- It was created to replace DBC (Direct Bonded Copper) because of their better electrical, thermal and mechanical performance, in addition, it has the advantage of lower cost potential.
Important Factors for an excellent Metallized Substrate

   * Heat dissipation of the Metallized Substrate(DPC)

Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability, therefore thermal management is critical. Many of today's hottest and most promising fields depend on metallized ceramics. For example, effective heat dissipation ensuring the long life of an LED product and it depends on effectively controlling the operating temperature of the LEDs. Put simply: Controlled conduction of heat means not only increased life time but equally stabilizes the LED’s color. Getting rid of the heat offers is another important advantage: A high luminous flux.

Check out how Tong Hsing can get it done effectively.

   * Size of DPC Metallized Substrate

Miniaturization of electric and electronic instruments depends largely the high packaging density of the circuit. A metallized ceramic capacitor has the advantages of small size, meaning a large capacitance is obtained in a small size of capacitor, the high density of mounting on a printed circuit board is possible by bonding the chip capacitor on a flat conductive pattern. The microelectronics industry commonly uses ceramic or glass monolythic chip capacitors for printed circuit board construction.

Check out how Tong Hsing does it. ( http://metallized-ceramic.ready-online.com/ )

Tong Hsing, a patented company (Patent No.: US 6,800,211 B2) invented a method for removing voids in a ceramic substrate, and more particularly a method including a chemical copper plating process after a sputtering titanium/copper step. The chemical copper plating step is able to successfully and electrically communicate both sides of the ceramic substrate so that when the copper pattern is formed on both sides of the ceramic substrate, communication is established.

Conventional leads of printed circuit ceramic substrates are made through a special metal mask in a vacuum environment by sputtering technology or evaporating technology. Because the leads are very thin and some oxide or nitride is mixed in the leads, it is necessary to use the ceramic substrate with high flatness, and an alumina material purity of 99.6%. For the above reason, the cost of the fabrication is very high. For another conventional process of printed circuit ceramic substrates, the cost is low, but the flatness of the circuit is not satisfactory to reach the requirement of a high frequency circuit. The best width of the leads and width between each lead is 6 mil. For high frequency circuits. This process can not meet the requirements thereof. Furthermore, while preparing a ceramic substrate, titanium/copper sputtering is employed to communicate both sides of the substrate. However, because there are holes defined in the ceramic substrate, and if the dimension of some of the holes is smaller than 100u, the process of sputtering can not ensure that all the holes are covered with a layer of titanium/copper so that when the pattern is formed on the substrate, communication between both sides of the ceramic substrate is not satisfactory. Therefore, it is an objective of the invention to provide an improved method to solve these problems.

Tong Hsing's ( http://metallized-ceramic.ready-online.com/company-story.... ) more than 30-years of experience can ensure your product is made based on design. That is - satisfaction is guaranteed

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Tong Hsing's more than 30-years of experience can ensure your product is made based on design. That is - satisfaction is guaranteed . http://metallized-ceramic.ready-online.com