Feb. 27, 2009 -
PRLog -- Malaysian Industry-Government Group for High Technology (MIGHT), Malaysia Institute of Microsystems (MIMs) together with International Society for Quality Electronic Design (ISQED.org) and with support from Malaysian Industrial Development Authority (MIDA) will be hosting an International Symposium on Quality Electronics Design in July 2009 called ASQED. This symposium also gathers leading industrial and educational entity such as Intel Malaysia, STATS ChipPAC Malaysia and Swinburne University of Technology as committee members. As part of this symposium that will bring world class presenters on Electronic Design to Malaysia, opportunities will be given through the technical paper presentation sessions for technical paper presentations. Papers accepted for presentations will be published by IEEE.
Tentatively, 14 technical sessions offering a total of 63 slots for technical paper presentations and publications allocated for the 2 days event.
ASQED’09 (also known as ISQED-ASIA’09)
is the first event organized by the International Society for Quality Electronic Design in Asia. This event is being co-organized and managed by Malaysia Institute of Microsystems (MIMs) of Malaysia. In continuations of 10 years of successful leadership by ISQED conference in USA, ASQED’09 strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. The conference promotes and emphasizes a holistic approach toward electronic design and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology, and IC Packaging, Test, and Manufacturing communities. ASQED’09 spans two days, Wednesday and Thursday, in three parallel tracks, hosting over 60 technical presentations, several keynote speakers, tutorials and other informal meetings. Conference proceedings will be published by IEEE and posted in the IEEE digital library
Papers are requested in the following areas
• Circuit & System Design
• Test & Verification
• IC Packaging Technology
• PCB and PWB Technology & Manufacturing
• Semiconductor Technology & Manufacturing
• Nano and Bio Electronics Innovations
• Photovoltaic Technology & Manufacturing
• Electronic Design Automation Methodologies.
Paper submission must be done on-line through the conference web site at www.isqed-asia.org. The guidelines for the final paper format are provided on the conference web site.
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The 1st ASQED 2009 will continue the 10 years of successful leadership by ISQED USA in bridging the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing and to achieve design quality in Asia.
