 Reballing Preforms Now Available in 3 daysReballing preforms, used to reattach solder balls to semiconductor packages after there removal, are placed on to devices before re-attachment. Since there are thousands of patterns having the right one in stock quickly for repair is key for a quick turn around on the repair. BEST now offers as standard a 3 day delivery with an optional 24 hour expedited service.
By: BEST Inc ROLLING MEADOWS, Ill. - Sept. 7, 2013 - PRLog -- BEST Inc announces that its popular EZReball™ reballing preforms are now available in 3 days as a standard lead time. With the addition of staff and added laser capacity, BEST is now in position to reduce its lead time on the EZReball™ product. These shortened deliveries are limited to a few packs but overall lead times for larger orders have been brought down due to these enhancements. Expedited 24 hour turn time services are also available, even for new patterns. EZReball™ preforms are a fast, easy-to-use preloaded soldering stencils which allows users to quickly and reliably place new solder balls on to BGA and CSP packages down to 0.3mm pitch. After deballing and prepping the component the EZReball™ preform is placed on to a flat surface.The fluxed package is then placed on top of the preform as it is “squared up” to the exact outline of the package. After reflow the adhesive backing on the preform is simply “lifted up” and the new balls are now attached to the device. EZReball™ preforms are packaged in a (15) pack for easy use. There are hundreds of existing patterns and new patterns do not have any tooling charges. Preforms are available in both tin-lead and SAC alloy solder balls. Orders can be placed either with BEST Inc are via its online store at www.soldertools.net. http://www.youtube.com/
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