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Follow on Google News | Cannon Technologies Announces Partnership with AsisCannon Electronic Packaging part of the award winning Cannon Technologies Group announces partnership deal with Asis, a global designer and manufacturer of complete enclosure systems for ATCA, CompactPCI and custom applications.
By: Cannon Technologies Asis, part of the Trans Innovation Group, produces a range of 19” rack-mountable ATCA chassis available in a variety of sizes from one to fourteen slots that were originally designed for the telecommunications market and are now used in a variety of markets, such as defence, medical, enterprise and cloud computing. The firm’s headquarters house more than 30 research and development engineers, including mechanical engineers with experience in thermal and fluid dynamics, PCB designers, systems engineers, and a software department. Trans Innovation Group is a provider of electronic components, cable assemblies, electronic cabinets and computing system solutions. The Group offers custom built manufacturing services and off-the-shelf products to over 480 OEMs, CEMs, start-ups, and multinational corporations in various industries. “The chief focus for the partnership will be to develop new relationships with OEM, TEM, and chassis system integrators within the communications, test and measurement, security and defence, medical, and scientific markets,” explains Glenn Conlon, director of business development, Cannon Electronic Packaging. The agreement will see Asis, previously successfully focussed on the U.S. and China, teaming up with Cannon to take on the European, Middle East, and African markets. Cannon is to help drive further sales growth throughout the EMEA region as well as play a vital part in facilitating support for a global customer base. “We are delighted with being instrumental in Asis’s expansion plans into the EMEA region,” says Cannon Technologies’ “Asis was actively involved in the formation of the ATCA standard since its inception in 2001 and was chosen by Intel to co-develop the market’s first ATCA chassis,” says Shai Benchmuel, sales director at Asis. “Our goal is to lead the ATCA market by leveraging our expertise in high-speed interconnect and thermal modelling to develop ATCA products that exceed the standard in performance and market requirements.” For more information visit: www.cannonep.co.uk (ENDS) ABOUT CANNON ELECTRONIC PACKAGING Cannon Electronic Packaging (CEP) is part of Cannon Technologies, the award winning international leader in innovative containment systems. CEP delivers sustainable, high-performance electronic packaging services. It offers extensive support through a world-class engineering team and provides resources in all areas from mechanical and plastics technologies, backplanes to embedded systems. CEP’s solutions are used across all major sectors including general electronics, communications, broadcast, test and measurement, medical, defence and transportation, utilities and automation. For more information visit: www.cannonep.co.uk ABOUT CANNON TECHNOLOGIES With a 35-year pedigree, Cannon Technologies provides T4 Data Centre Solutions around the globe – from turnkey data-centre projects up to TIA 942 Tier 4 to suites of intelligent, environmentally managed infrastructure racks, including cold-aisle cocooning, per-rack access control, video surveillance, intelligent power distribution and UPSs. At a top turnkey level Cannon designs, supplies, integrates and commissions the ‘IT’ architecture for military and commercial applications, for mission-critical projects. For more information please visit www.cannontech.co.uk End
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