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Follow on Google News | Cannon Electronic Packaging Announces its Range of Industry Leading SolutionsBy: Cannon Technologies This is the latest in a series of activities that have seen CEP form strategic partnerships with Polyrack Tech-Group, the leading German manufacturer of subracks, cases and packaging for electronic equipment; and Asis, a global designer and manufacturer of complete enclosure systems for ATCA, CompactPCI and custom applications. ‘To ensure consistent, high-speed data transfer and system reliability, sensitive electronic components require effective protection,’ Utilising standards-based electronic packaging reduces upfront development costs and technical risk, while providing the latest proven technologies in a cost-effective platform. Included in CEP’s product portfolio are Polyrack Tech-Group’s market leading FutureX series comprising subrack and case solutions that come in a diverse range of heights, widths and depths to suit all requirements. Meanwhile, Asis produces an innovative range of 19” rack mountable ATCA chassis available in a variety of sizes from one to 14 slots, and which are suitable for use in a variety of markets, such as defence, medical and data centres. CEP works closely with its partners to configure standard product platforms, off platform, customised off the shelf (COTS) and totally customised solutions. This is a full Level 1 to Level 5 service that also includes project management and production engineering controls, through to integration and test, transport, storage and end-of-life facilities. Utilising CEP’s vast knowledge and experience means customers can benefit from a reduced time to market and lower development costs. Thanks to the company’s wide-ranging expertise in metals, plastics, castings and electronics technologies, it is able to produce aesthetically pleasing systems that are reliable, flexible and rugged. CEP’s Glenn Conlon concluded, ‘Combining our own experience in this sector with products from Polyrack Tech-Group and Asis means that our design engineers are now equipped with the capability to rapidly develop and deploy innovative and high specification electronic packaging systems to the market.’ In order to showcase the diversity of its offering and to explain its approach to project fulfilment, CEP has produced its new 32-page full colour Electronic Packaging and Embedded Systems Solutions Guide. Containing a wealth of product and service information, it also explains how CEP can meet the multi-faceted business needs of businesses across all sectors. To obtain a copy visit http://www.cannontech.co.uk/ ABOUT CANNON ELECTRONIC PACKAGING Cannon Electronic Packaging (CEP) is part of Cannon Technologies, the award winning international leader in innovative containment systems. CEP delivers sustainable, high-performance electronic packaging services. It offers extensive support through a world-class engineering team and provides resources in all areas from mechanical and plastics technologies, backplanes to embedded systems. CEP’s solutions are used across all major sectors including general electronics, communications, broadcast, test and measurement, medical, defence and transportation, utilities and automation. For more information visit: http://www.cannontech.co.uk/ ABOUT CANNON TECHNOLOGIES With a 35-year pedigree, Cannon Technologies provides T4 Data Centre Solutions around the globe – from turnkey data-centre projects up to TIA 942 Tier 4 to suites of intelligent, environmentally managed infrastructure racks, including cold-aisle cocooning, per-rack access control, video surveillance, intelligent power distribution and UPSs. At a top turnkey level Cannon designs, supplies, integrates and commissions the ‘IT’ architecture for military and commercial applications, for mission-critical projects. For more information please visit www.cannontech.co.uk End
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