Acrosser Releases Two COM-Express Basic Modules Featuring Intel Core i7 Processors and HM76 Chipsets

July 23, 2015 - PRLog -- ACROSSER Technology, a world-leading embedded single-board computer manufacturer, is pleased to introduce its two latest COM-Express (COMe) Type 6 modules, AMB-HM76B1FL and AMB-HM76B1. Both embedded COMe basic modules contain two DDR3 SO-DIMMs, for a memory capacity of up to 16GB. As for OS support, both COMe basic modules support Windows® 7, LINUX Kernel 3.3 (Fedora 17), and LINUX Kernel 3.5 (Ubuntu 12.10).

The main difference between the two boards is the cooling fan system. Built with performance-based customers in mind, AMB-HM76B1 is equipped with a fan on its board. On the other hand, for customers who work with COMe modules in dusty, difficult environments, or who want to integrate the module into an open-frame chassis, the fanless AMB-HM76B1FL might be a more viable option. Acrosser understands that each systems integrator has unique requirements for their embedded hardware. To cater to the diverse needs of industry leaders, Acrosser has developed two types of COMe modules, enabling customers to choose the module most suitable for their solution.

Easy removal of the COMe modules makes them an ideal solution when upgrading current project. Systems integrators can keep their current I/O baseboard and replace with a new COMe module to optimize their current system. This hassle-free upgrade method is widely accepted in the current embedded computing industry. Please contact the nearest Acrosser sales team associate for a quote or send us an inquiry via Acrosser Web site!

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Product Information:
COM Express Type 6 Module: AMB-HM76B1
COM Express Type 6 Module: AMB-HM76B1FL

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