ERS welcomes Debbie Claire Sanchez as Fan-Out Wafer Level Packaging (FOWLP) Equipment Strategic Product Manager

MUNICH - Nov. 9, 2018 - PRLog -- ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, is proud to announce that effective immediately Debbie Claire Sanchez is becoming the Strategic Product Manager for its FOWLP product line in Germering, Germany.

In hiring Debbie Claire Sanchez, ERS is gaining a distinguished industry expert. After finalizing her Masters' degree in physics at Mindanao State University, Debbie-Claire worked for more than seven years in the field of wafer level packaging, both fan-in and fan-out. She spent the first two years of her career working on the photolithography process as a Process Development Engineer. She then focused the last five years of her career on fan-out wafer and panel level reconstruction process development with DECA Technologies (Philippines). Recently, she was in charge of an account development and associated technology transfer in Taiwan.

"I am thrilled to join the ERS family, a company that has strong values of innovation and growth at its core. I believe that at ERS we can create groundbreaking FOWLP manufacturing tools that will ultimately bring productivity enhancement for our clients," says Debbie Claire Sanchez.

"We are excited to have Ms. Sanchez joining us at ERS electronic GmbH, I believe that her insight and customer´s experience in FOWLP will be key for our ability to continue innovating with a customer-centric mindset moving forward," says Klemens Reitinger.

About ERS:

ERS electronic GmbH, based in Germering near Munich, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers right across the semiconductor industry.

Press contact:
Miguel A. Resendiz Jimenez
PR & MarCom
m.resendiz@ers-gmbh.de
+49-152-2306-7851
https://www.ers-gmbh.com/