Follow on Google News News By Tag Industry News News By Location Country(s) Industry News
Follow on Google News | Wafer Level Packaging (WLP) Market Trends, Scope, Demand, Opportunity and Forecast by 2026By: IMARC Group The wafer-level packaging (WLP) refers to a type of packaging solution used for devices, such as microphones, accelerometers, pressure sensors, transistors etc., to add a protective layer of electronic connections and integrated circuits (ICs). Fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP, etc., are some commonly used WLP integration types. These packaging solutions provide numerous benefits, such as a reduction in the size of the wafer chips, improvements in chip functionalities, and streamlining of the manufacturing processes. The ultrathin wafers also offer improved heat dissipation and performance, form factor reduction, and minimal power consumption. Significant growth in the electronics sector worldwide is primarily driving the market for wafer level packaging growth. Furthermore, the escalating requirement for compact consumer electronics is also propelling the demand for cost-effective and efficient packaging solutions for enhanced mechanical protection and structural support of the devices. Besides this, several technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are also providing a thrust to the global market. Numerous other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive R&D activities to launch advanced product variants, are expected to further drive the market growth in the coming years. Competitive Landscape: Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation. For more information about this report visit: https://www.imarcgroup.com/ Insight on Market Segmentation: Breakup by Packaging Technology: 3D TSV WLP 2.5D TSV WLP WLCSP Nano WLP Others Breakup by End Use Industry: Aerospace and Defense Consumer Electronics IT & Telecommunication Healthcare Automotive Others Get a PDF Sample for more detailed market insights: https://www.imarcgroup.com/ About Us IMARC Group is a leading market research company that offers management strategy and market research worldwide. We partner with clients in all sectors and regions to identify their highest-value opportunities, address their most critical challenges, and transform their businesses. Contact Us 30 N Gould St Ste R Sheridan, WY 82801 USA Email: sales@imarcgroup.com Website: https://www.imarcgroup.com End
|
|