Major Upgrade for Raytron Micro Thermal Imaging Module at SPIE Photonics Europe: New Performance Meets Diverse Customer DemandsAt the core of the TINY2-C lies the InfiRay ASIC, delivering unparalleled imaging capabilities that redefine industry standards. Its compact form factor, measuring at a mere 13.2mm×13.2mm× "The TINY2-C sets a new benchmark for infrared imaging technology," Beyond its performance prowess, the TINY2-C offers a rich array of features designed to cater to diverse user needs. Its extensive interface compatibility, including DVP, VOSPI, MIPI, and USB, facilitates seamless integration with virtually any SOC platform, enhancing flexibility and ease of use. One of the most compelling features of the TINY2-C is its revolutionary shutterless technology, which eliminates the need for shutter calibration, reducing shutter frequency and enhancing user experience across the board. Furthermore, the TINY2-C is available in both imaging and temperature measurement versions, catering to a wide range of applications. The imaging version delivers high-frame-rate output, while the temperature measurement version offers precise thermal readings, with optional lens sizes ranging from 2.0mm to 7.0mm. For more information on the TINY2-C infrared thermal module and to schedule a demonstration at the SPIE Photonics Europe 2024 Exhibition, visit Booth Number 223 or contact the Marketing Department of Raytron. Media Contact: Raytron Marketing Department E-mail: marketing@raytrontek.com Website: https://www.infiray.com/ End
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