FIBERSTAMP Press Releases

FIBERSTAMP announced that it will exhibit at DesignCon 2026, where it will demonstrate its next-generation 800G HYBRID ACC+ Active Copper Cable and an 800G silicon photonics module based on the HYBRID architecture.

Balancing power efficiency, signal integrity, and scalability for next-generation 800G and 1.6T interconnects

As AI workloads expand and data center demands intensify, the architecture of optical interconnect systems is evolving. Traditional pluggable optics face challenges in power, bandwidth density, and system efficiency.

Next-Generation Optical Interconnects for AI and HPC Systems

FIBERSTAMP has announced the launch of its 400G QSFP-DD ER4-30km optical module, built on narrow-grid LAN-WDM wavelengths.

FIBERSTAMP, a provider of cost-optimized DWDM optical communication solutions, today announced its participation in Network X 2025, the world's leading telecom and digital ecosystem exhibition, to be held October 14–16 at Paris Expo Porte de...

FIBERSTAMP's zero-FEC optical modules deliver deterministic nanosecond latency for financial trading, AI, and edge networks.

We're excited to bring our innovation in silicon photonics, co-packaged optics (CPO), and high-speed optical interconnects into the OCP ecosystem — contributing to a more open, efficient, and sustainable digital future.

Working together to shape a more open, connected, and high-performance optical future.

FIBERSTAMP Launches 2×100G PAM4-Based 200G QSFP56 SR2 Optical Module to Power Next-Gen Data Center Connectivity

High Density, Low Power, and Cost-Effective — Powering the Next Generation of Data Center Upgrades

FIBERSTAMP is bringing cutting-edge innovation to OFC 2025 with our groundbreaking 8-way Optics, O-BAND DWDM, and CPO solutions! Get ready to explore the next generation of high-performance connectivity.