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Follow on Google News | Portwell Launches a Rugged Fanless Embedded System Designed with Intel Atom Processor E3900 SeriesPortwell's WEBS-13D1 rugged fanless embedded system, powered by Intel Atom processor E3900 series (formerly Apollo Lake), is a perfect solution for applications in image processing, kiosk, digital signage, medical, factory automation and IoT.
Portwell's new rugged WEBS-13D1 is equipped with the Portwell PEB-2773, a 3.5" form factor embedded board based on the Intel® Atom® processor E3900 series integrating the low power Intel® Gen9 graphics engine with up to 18 execution units which improves 3D graphics performance and supports faster 4K encode and decode operations. The compact WEBS-13D1 embedded system also features DDR3L SO-DIMM up to 8GB supporting 1866/1600 MT/s; 6x USB 3.0 ports; one DisplayPort (DP) and one HDMI on rear I/O with resolution up to 4096 x 2160; one smart COM port for RS-232/422/485 selected by BIOS and three COM ports for RS-232 on rear I/O; and multiple storage with 2.5" HDD/SSD and mSATA. In addition, the compact 200(W) × 150(D) × 80(H) mm chassis platform integrates the Mini PCIe interface which provides wireless connectivity such as Wi-Fi, Bluetooth, NFC (near-field communication) The Portwell WEBS-13D1 delivers better and faster performance than its predecessors, yet it is still packed within a compact system dimension (200(W) × 150(D) × 80(H) mm). Moreover, it operates with thermal design power (TDP) under 12W for fan-less applications and also supports a wide voltage of power input from 12V to 24V for rugged applications. Portwell's WEBS-13D1 embedded system series is built from rugged box PC by Portwell's own engineering team to simplify system customization. Its ingenious mechanical design features a compact footprint that enables flexible wall mounting or panel mounting. Specifically, this flexible structure makes it easy to adjust chassis size to meet different board form factors for different applications. The Portwell WEBS-13D1 further benefits from this flexible design concept for the system enclosure with top cover/heat sink mechanism that facilitates efficient heat dissipation. The rugged and compact WEBS-13D1 supports a wide industrial temperature range from -20°C to 60°C for harsh environment operations, while at the same time, its fan-less design ensures reliability, silent operation and low maintenance rate and costs. With its fan-less design and superior performance— Product details: http://www.portwell.com/ Product availability: In addition to American Portwell Technology, Inc. (http://www.portwell.com/ About American Portwell Technology American Portwell Technology, Inc., is a world-leading innovator in the embedded computing market and an Associate member of the Intel® Internet of Things Solutions Alliance. American Portwell Technology designs, manufactures and markets a complete range of PICMG computer boards, embedded computer boards and systems, rackmount systems and network communication appliances for both OEMs and ODMs. American Portwell is an ISO 9001, ISO 13485, ISO 14001 and TL 9000 certified company. The company is located in Fremont, California. For more information about American Portwell's extensive turnkey solutions and private-label branding service, call 1-877-APT-8899, email info@portwell.com or visit us at http://www.portwell.com. Intel and Atom are trademarks of Intel Corporation in the United States and other countries. All other products and company names referred to herein may be trademarks or registered trademarks of their respective companies or mark holders. End
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