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Follow on Google News | Omniseal Solutions & Saint-Gobain Businesses Collaborate At Semicon WestDelivering Sealing, Fluid Handling & Grinding Solutions For Critical Semiconductor Processes
The three businesses join forces to offer a wide range of high-performance solutions that meet the stringent requirements found in the semiconductor fabrication process. With their combined solutions, the businesses support a wide range of critical applications: 1. Omniseal® polymers and metals, and Meldin® polyimides 2. Furon® pumps, valves, manifolds, fittings, tubing and accessories 3. High-precision grinding, slicing, dicing, sawing, thinning, and finishing of electronic components An emerging trend in the global semiconductor market includes a rising need for resilient sealing solutions that protect sensitive electronic components, withstanding higher temperatures, pressures, and corrosive environments. Omniseal Solutions solves these challenges with their spring-energized seals, metal C-Seals and thermoset polyimides. These solutions are engineered for sealing and contamination control, which ensure stability and performance in semiconductor applications such as wafer cleaning, etching and chemical mechanical planarization equipment. Another emerging trend is a focus on environmental protection, driving the demand for more sustainable sealing materials. In rapid response, Omniseal Solutions is creating *PFAS-Free sealing solutions that are minimizing environmental impact. An example in the semiconductor industry is their PFAS-Free* spring-energized seals used in hot melt dispensing machines (https://www.omniseal- Note: *PFAS-Free here means we do not intentionally add PFAS material in the product, but does not exclude the possibility of traces, as these materials are common in the environment. Aside from this US-based event, Omniseal Solutions is committed to other semiconductor initiatives, exhibiting at other SEMICON key events.
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