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Follow on Google News | NINZIA to Participate Hack Osaka 2024NINZIA to Exhibite at the Startup Showcase and Delivere a PR Pitch
By: NINZIA Inc. Event Overview Event Name: Hack Osaka 2024 Date and Time: November 26, 2024, from 10:30 to 18:30 Location: Grand Front Osaka North Building, B2F, 3-1 Ofukacho, Kita-ku, Osaka About NINZIA Inc. Our company specializes in next-generation binding materials. Our flagship product,NINZIA PASTE, is a revolutionary konjac-based paste that enhances versatility in food processing. By combining NINZIA PASTE with other ingredients and applying heat, freezing, or drying, we create a robust gel that supports effective binding and molding, while ensuring resistance to retort processing and freezing. We develop allergen-free solutions without unnecessary additives like wheat gluten or eggs. By leveraging the natural fiber glucomannan found in Konjac, we aim to provide enjoyable, healthy meals for those with dietary restrictions, such as diabetes or allergies. The molding technology of NINZIA has received high praise in markets such as Dubai in the UAE, the Basque region in Spain, Silicon Valley in the U.S., and Singapore. ❜❜❜ NINZIA Inc. Head Office 650-0035 Naniwa-cho 56, Chuo-ku, Kobe, KiP Osaka Office & Lab 555-0011 2-6-18 Takeshima, Nishiyodogawa- NINZIA Official Website https://ninzia.jp/ Online Shop https://store.ninzia.jp/ End
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